Manufacturing process - Company Ranking(7 companies in total)
Last Updated： Aggregation Period:Oct 08, 2025〜Nov 04, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Characteristics】 ■Thickness [mm]: 0.03 ■Tensile Strength [MPa]: 205 ■Elongation [%]: 50 ■Surface Roughness (Rmax) [um]: 0.5～1 ■Ther... | 【Purpose】 ■ For semiconductor TCB (thermal compression bonding) process release ■ Prevention of chip damage ■ Prevention of contamination of... | ||
|
---
--- |
--- | ||
Nitto L Materials
-
- Featured Products
-
Semiconductor manufacturing process TCB {Thermal Compression Bonding} release film "HR-S051"
- overview
- 【Characteristics】 ■Thickness [mm]: 0.03 ■Tensile Strength [MPa]: 205 ■Elongation [%]: 50 ■Surface Roughness (Rmax) [um]: 0.5～1 ■Ther...
- Application/Performance example
- 【Purpose】 ■ For semiconductor TCB (thermal compression bonding) process release ■ Prevention of chip damage ■ Prevention of contamination of...
-
Nitto L Materials
Membership (free) is required to view all content.
Already a Member? Log In Here
